- Patent Title: Coil component and wireless communication circuit using the same
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Application No.: US17403575Application Date: 2021-08-16
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Publication No.: US11804654B2Publication Date: 2023-10-31
- Inventor: Masaki Matsushima , Makoto Orikasa , Ryota Uchiyama , Junpei Hayama
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP 20138226 2020.08.18
- Main IPC: H01Q1/36
- IPC: H01Q1/36 ; H01Q7/00 ; H01Q1/38

Abstract:
Disclosed herein is a coil component that includes a substrate, a coil pattern formed on one surface of the substrate, and a magnetic layer comprising a composite material obtained by dispersing magnetic particles in resin and formed on the one surface of the substrate so as to cover the coil pattern. The coil pattern has a flat shape in which a thickness thereof is smaller than a radial width. Each of the magnetic particles has a flat shape in which a thickness thereof in a direction perpendicular to the one surface of the substrate is smaller than a diameter in a direction parallel to the one surface of the substrate. Some of the magnetic particles exist within a height range of the coil pattern with respect to the one surface of the substrate.
Public/Granted literature
- US20220059938A1 COIL COMPONENT AND WIRELESS COMMUNICATION CIRCUIT USING THE SAME Public/Granted day:2022-02-24
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