Invention Grant
- Patent Title: Integrated piezoresistive and piezoelectric fusion force sensor
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Application No.: US18081255Application Date: 2022-12-14
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Publication No.: US11808644B2Publication Date: 2023-11-07
- Inventor: Julius Minglin Tsai , Ryan Diestelhorst , Dan Benjamin
- Applicant: NEXTINPUT, Inc.
- Applicant Address: US CA Mountain View
- Assignee: Qorvo US, Inc.
- Current Assignee: Qorvo US, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: G01L1/16
- IPC: G01L1/16 ; G01L1/18 ; G01L5/00 ; B81B3/00

Abstract:
Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including both piezoresistive and piezoelectric sensing elements and integrated with complementary metal-oxide-semiconductor (“CMOS”) circuitry on the same chip. The sensor employs piezoresistive strain gauges for static force and piezoelectric strain gauges for dynamic changes in force. Both piezoresistive and piezoelectric sensing elements are electrically connected to integrated circuits provided on the same substrate as the sensing elements. The integrated circuits can be configured to amplify, digitize, calibrate, store, and/or communicate force values electrical terminals to external circuitry.
Public/Granted literature
- US11754451B2 Integrated piezoresistive and piezoelectric fusion force sensor Public/Granted day:2023-09-12
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