Invention Grant
- Patent Title: Field device assembly including improved dielectric insulation system
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Application No.: US17486141Application Date: 2021-09-27
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Publication No.: US11808647B2Publication Date: 2023-11-07
- Inventor: Andrew John Wagener , Jacob Daniel Holm , Sydney Jane Jones
- Applicant: Rosemount Inc.
- Applicant Address: US MN Shakopee
- Assignee: ROSEMOUNT INC.
- Current Assignee: ROSEMOUNT INC.
- Current Assignee Address: US MN Shakopee
- Agency: Westman, Champlin & Koehler, P.A.
- Main IPC: G01L19/00
- IPC: G01L19/00 ; F16L23/16 ; H01B17/56

Abstract:
An industrial process field device includes a pressure sensor, and a housing containing the pressure sensor. The housing includes a base having a base interface and a first base process opening. A flange is attached to the base and includes a flange interface having a first flange process opening. A first gasket process opening of a gasket is aligned with the first base process opening and the first flange process opening. A first surface of the gasket engages the base interface, and a second surface of the gasket engages the flange interface. A dielectric insulation system includes at least one dielectric layer that insulates the housing from electrical currents conducted through the flange. Each dielectric layer includes a layer of ceramic material, an anodized layer, or a plastic overmold, which improve a maximum working pressure of the field device.
Public/Granted literature
- US20230096421A1 FIELD DEVICE INTERFACE SEAL AND ELECTRICAL INSULATION Public/Granted day:2023-03-30
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