- 专利标题: Multi-layered ceramic electronic component
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申请号: US17389803申请日: 2021-07-30
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公开(公告)号: US11817259B2公开(公告)日: 2023-11-14
- 发明人: Je Jung Kim , Dong Yeong Kim , Woo Chul Shin , Ji Hong Jo
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR 20180160024 2018.12.12
- 主分类号: H01G4/232
- IPC分类号: H01G4/232 ; H01G4/30 ; H01G4/248 ; H01G4/008 ; H01G4/012 ; H01G4/12
摘要:
A multi-layered ceramic electronic component has a ceramic body including dielectric layers and a plurality of internal electrodes opposing each other with the dielectric layers interposed therebetween. External electrodes are disposed on an exterior of the ceramic body and are electrically connected to the internal electrodes. Each external electrode includes an electrode layer electrically connected to internal electrodes, and a conductive resin layer arranged on the electrode layer. The conductive resin layer extends to first and second surface of the ceramic body, and a ratio of a thickness (Tb) of the conductive resin layer extending onto the first surface and the second surface of the ceramic body to a length (Lm) of a length direction margin portion of the ceramic body satisfies 2 to 29%.
公开/授权文献
- US20210358691A1 MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT 公开/授权日:2021-11-18
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