- 专利标题： Method for processing electronic/electrical device component scraps
-
申请号： US17598949申请日： 2020-03-27
-
公开(公告)号： US11819885B2公开(公告)日： 2023-11-21
- 发明人: Katsushi Aoki , Hidetoshi Sasaoka
- 申请人： JX Nippon Mining & Metals Corporation
- 申请人地址： JP Tokyo
- 专利权人： JX METALS CORPORATION
- 当前专利权人： JX METALS CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： JP 19069381 2019.03.29
- 国际申请： PCT/JP2020/014366 2020.03.27
- 国际公布： WO2020/203917A 2020.10.08
- 进入国家日期： 2021-09-28
- 主分类号： B07B9/00
- IPC分类号： B07B9/00 ; B03C1/23 ; B09B3/35 ; B07B4/08 ; B09B101/17
摘要：
Provided is a method for processing electronic and electrical device component scraps, which can selectively recover a substrate scrap including a substance intended to be recovered. A method for processing electronic and electrical device component scraps, including separating a substrate with lead wires contained in the electronic and electrical device component scraps before sorting the electronic and electrical device component scraps by magnetic sorting.
公开/授权文献
信息查询
IPC分类:
