发明授权
- 专利标题: Dimming substrate, manufacturing method thereof, dimming structure and dimming module
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申请号: US17483623申请日: 2021-09-23
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公开(公告)号: US11828965B2公开(公告)日: 2023-11-28
- 发明人: Changyin Wang , Juan Chen , Peng Liang , Chunlei Wang , Jing Yu
- 申请人: Beijing BOE Sensor Technology Co., Ltd. , BOE Technology Group Co., Ltd.
- 申请人地址: CN Beijing
- 专利权人: Beijing BOE Sensor Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- 当前专利权人: Beijing BOE Sensor Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- 当前专利权人地址: CN Beijing; CN Beijing
- 代理机构: IPro, PLLC
- 优先权: CN 2110065354.4 2021.01.18
- 主分类号: G02B5/30
- IPC分类号: G02B5/30 ; G02B27/28 ; B60J3/04 ; G02F1/1337 ; B60J1/00 ; G02F1/1333
摘要:
The present disclosure provides a dimming substrate, a manufacturing method of the dimming substrate, a dimming structure and a dimming module, and relates to the technical field of display. According to the present disclosure, a bonding layer, a flexible base plate, an electrode layer and an orientation layer are sequentially arranged on a rigid carrier plate, and the bonding layer includes one or more adhesive layers. By removing flexible base films from the bonding layer, the bonding layer only includes one or more adhesive layers, such that the dimming substrate includes less flexible base films.
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