- 专利标题: Vertical memory device
-
申请号: US17212222申请日: 2021-03-25
-
公开(公告)号: US11830805B2公开(公告)日: 2023-11-28
- 发明人: Dongha Shin , Jeawon Jeong , Bongsoon Lim
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Gyeonggi-Do
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: KR 20200060899 2020.05.21
- 主分类号: H01L23/522
- IPC分类号: H01L23/522 ; H01L25/065 ; H01L25/18 ; H10B41/27 ; H10B43/27 ; H01L23/00
摘要:
A vertical memory device includes a plurality of word lines on a substrate, a plurality of word line cut regions extending parallel to each other, a memory cell array comprising a plurality of channel structures extending on the substrate through the plurality of word lines and arranged in a honeycomb structure, a plurality of contacts on the plurality of channel structures, and a plurality of bit lines connected to the plurality of channel structures through the plurality of contacts. The memory cell array comprises a first sub-array and a second sub-array, which are defined by the plurality of word line cut regions and are connected to some identical bit lines from among the plurality of bit lines, and a layout of contacts in the first sub-array from among the plurality of contacts is different from a layout of contacts in the second sub-array from among the plurality of contacts.
公开/授权文献
- US20210366825A1 VERTICAL MEMORY DEVICE 公开/授权日:2021-11-25
信息查询
IPC分类: