- Patent Title: Electronic device including antenna and heat dissipation structure
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Application No.: US17974083Application Date: 2022-10-26
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Publication No.: US11832381B2Publication Date: 2023-11-28
- Inventor: Seunghan Seo , Jongpill Lee , Changwon Jang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: The Farrell Law Firm, P.C.
- Priority: KR 20190043503 2019.04.15
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01Q1/24 ; H01Q1/22
Abstract:
Electronic device includes a housing; an antenna module accommodated in the housing, the antenna module including a PCB including a first side and a second side opposite to the first side; one or more antenna elements disposed at the first side of the PCB; and a wireless communication circuit disposed at the second side of the PCB and configured to transmit and/or receive a radio signal through an antenna element of the one or more antenna elements; and a conductive member accommodated in the housing and including a supporting portion and a connecting portion extended from the supporting portion and connected to the conductive portion of the housing, the supporting portion configured to support the antenna module such that the first side of the PCB faces in a direction toward the lateral surface of the electronic device, and the connecting portion including a hole through which a fastening member is disposed to fasten the conductive member to the conductive portion of the housing. Heat generated by the antenna module is transferred to the conductive portion of the housing.
Public/Granted literature
- US20230049711A1 ELECTRONIC DEVICE INCLUDING ANTENNA AND HEAT DISSIPATION STRUCTURE Public/Granted day:2023-02-16
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