发明授权
- 专利标题： Circuit board
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申请号： US17554101申请日： 2021-12-17
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公开(公告)号： US11832385B2公开(公告)日： 2023-11-28
- 发明人: Ki Joon Park , Sung Jin Noh , Jungu Lee
- 申请人： DONGWOO FINE-CHEM CO., LTD.
- 申请人地址： KR Iksan-si
- 专利权人： DONGWOO FINE-CHEM CO., LTD.
- 当前专利权人： DONGWOO FINE-CHEM CO., LTD.
- 当前专利权人地址： KR Iksan-si
- 代理机构： Sughrue Mion, PLLC
- 优先权： KR 20200183407 2020.12.24 KR 20210138564 2021.10.18
- 主分类号： H05K1/09
- IPC分类号： H05K1/09 ; H05K1/02 ; H05K1/11 ; H05K1/18 ; H01L33/62 ; H05K1/03 ; H01L25/075
摘要：
A circuit board includes a base layer, a seed layer formed on the base layer, and a first electrode layer formed on the seed layer. The seed layer is formed of a metal oxide with a thickness of 100 to 400 Å. The circuit board may further include an insulation layer formed on the first electrode layer and a second electrode layer formed on the insulation layer.
公开/授权文献
- US20220210915A1 CIRCUIT BOARD 公开/授权日：2022-06-30
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