发明授权
- 专利标题: Coil component
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申请号: US16573319申请日: 2019-09-17
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公开(公告)号: US11837388B2公开(公告)日: 2023-12-05
- 发明人: Byung Soo Kang , Ju Hwan Yang , Byeong Cheol Moon , Yoon Mi Cha , Mi Geum Kim
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR 20180138612 2018.11.13
- 主分类号: H01F27/28
- IPC分类号: H01F27/28 ; H01F27/29 ; H01F41/04 ; H01F41/12 ; H01F27/255
摘要:
A coil component includes a body including magnetic metal powder particles and an insulating resin; a coil portion embedded in the body; and first and second external electrodes respectively disposed on the body to be spaced apart from each other and respectively connected to both end portions of the coil portion. A magnetic metal powder particle exposed from a surface of the body, among the magnetic metal powder particles, has a plating prevention film formed on at least a portion of a surface thereof and containing metal ions of the exposed magnetic metal powder particle.
公开/授权文献
- US20200152370A1 COIL COMPONENT 公开/授权日:2020-05-14
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