Invention Grant
- Patent Title: Method of manufacturing a semiconductor device
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Application No.: US18085871Application Date: 2022-12-21
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Publication No.: US11837645B2Publication Date: 2023-12-05
- Inventor: Yoontae Hwang , Wandon Kim , Geunwoo Kim , Heonbok Lee , Taegon Kim , Hanki Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR 20200111053 2020.09.01
- Main IPC: H01L29/45
- IPC: H01L29/45 ; H01L29/78 ; H01L29/66 ; H01L29/417 ; H01L29/08 ; H01L23/532 ; H01L23/485 ; H01L23/522 ; H01L21/768 ; H01L21/8234 ; H01L29/06 ; H01L29/775 ; H01L29/423 ; H01L29/786 ; H01L21/285

Abstract:
A semiconductor device including a substrate; a fin active region on the substrate and extending in a first direction; a gate structure extending across the fin active region and extending in a second direction; a source/drain region in the fin active region on a side of the gate structure; an insulating structure covering the gate structure and the source/drain region; and contact structures penetrating through the insulating structure and respectively connected to the source/drain region and the gate structure, wherein one of the contact structures includes a seed layer on the gate structure or the source/drain regions and including lower and upper regions, the lower region having a first grain size and the upper region being amorphous or having a grain size different from the first grain size, and a contact plug on an upper region of the seed layer and having a second grain size.
Public/Granted literature
- US20230118906A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2023-04-20
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