Invention Grant
- Patent Title: Solid-state imaging device and electronic apparatus
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Application No.: US17689154Application Date: 2022-03-08
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Publication No.: US11838662B2Publication Date: 2023-12-05
- Inventor: Keisuke Hatano , Ryosuke Nakamura , Yuji Uesugi , Fumihiko Koga , Tetsuji Yamaguchi
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross PC
- Priority: JP 15217860 2015.11.05
- Main IPC: H04N25/704
- IPC: H04N25/704 ; H01L27/146 ; H04N25/76

Abstract:
Imaging devices and electronic apparatuses incorporating imaging devices are provided. An imaging device as disclosed can include a first pixel of a first pixel and a second pixel of a second pixel. The first and second pixels each have a first electrode, a portion of a photoelectric conversion film, and a portion of a second electrode, where the photoelectric conversion film is between the first electrode and the second electrode. The first electrode of the first pixel has a first area, while the first electrode of the second pixel has a second area that is smaller than the first area. The first pixel can include a light shielding film. Alternatively or in addition, the first pixel can be divided into first and second portions.
Public/Granted literature
- US20220264039A1 SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS Public/Granted day:2022-08-18
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