A grinding and polishing device includes a main body, a grinding disk, a sample disk, a first console, and a second console. The main body includes a support table and a support column. The support table is coupled to the support column. The grinding disk is fixed on the support table and includes a polishing surface. The sample disk is fixed on the support column and configured to hold a preform. The first console is electrically coupled to the sample disk and used for controlling a distance between the preform held by the sample disk and the grinding disk. The second console is electrically coupled to the grinding disk and used for controlling a working state of the grinding disk for grinding and polishing the preform.