Invention Grant
- Patent Title: Electronic device, external module thereof, manufacturing method of external module thereof and assembly method for configuring external module thereof
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Application No.: US17588167Application Date: 2022-01-28
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Publication No.: US11841742B2Publication Date: 2023-12-12
- Inventor: Tzu-Chiu Huang , Juei-Chi Chang , Jui-Lin Yang
- Applicant: GETAC TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: GETAC TECHNOLOGY CORPORATION
- Current Assignee: GETAC TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipel
- Agency: Cooper Legal Group, LLC
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H01R33/965 ; H01R43/00 ; H05K5/00 ; H01R13/52
Abstract:
The present invention provides an external module including a housing and an electronic component. One surface of the housing is provided with a through hole. The electronic component is disposed in the housing and includes a first connector, wherein the first connector is floatingly arranged in the housing and is exposed in the through hole.
Public/Granted literature
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