Invention Grant
- Patent Title: Semiconductor structure and manufacturing method thereof
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Application No.: US17353618Application Date: 2021-06-21
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Publication No.: US11842920B2Publication Date: 2023-12-12
- Inventor: Chun Hao Liao , Chu Fu Chen , Chun-Wei Hsu , Chia-Cheng Pao
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT LAW
- Agent Anthony King
- The original application number of the division: US16371900 2019.04.01
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/66 ; H01L29/76 ; H01L29/423 ; H01L29/06 ; H01L21/8234 ; H01L21/762

Abstract:
The present disclosure provides a semiconductor structure, including a transistor. The transistor includes a semiconductive substrate, a gate structure, a pair of highly doped regions and a dielectric element. The semiconductive substrate has a top surface. The gate structure is over the top surface. The pair of highly doped regions is separated by the gate structure. The dielectric element is embedded in the semiconductive substrate. The dielectric element is laterally and vertically misaligned with the pair of highly doped regions.
Public/Granted literature
- US20210313218A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-10-07
Information query
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