Invention Grant
- Patent Title: Multilayer ceramic electronic component
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Application No.: US17469158Application Date: 2021-09-08
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Publication No.: US11848158B2Publication Date: 2023-12-19
- Inventor: Min Hyang Kim , Hyung Duk Yun
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20200141216 2020.10.28
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30 ; H01G4/008 ; H01G4/248

Abstract:
A multilayer ceramic electronic component may include: a ceramic body including a dielectric layer and first and internal electrodes disposed to be stacked with the dielectric layer interposed therebetween; a first and a second external electrode disposed on the ceramic body. The first and the second external electrodes may include a first and a second base electrode layers disposed in contact with the ceramic body and a first and a second resin electrode layers disposed on the first and the second base electrode layer respectively, a width of the ceramic body in the second direction may be less than 1.0 mm, and 0.4×ta≤tb≤0.5×ta in which ta is an average thickness of the first base electrode layer and tb is an average thickness of the first resin electrode layer.
Public/Granted literature
- US20220130609A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2022-04-28
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