- 专利标题： Semiconductor device and method of manufacturing thereof
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申请号： US17391287申请日： 2021-08-02
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公开(公告)号： US11848310B2公开(公告)日： 2023-12-19
- 发明人: Won Geol Lee , Won Chul Do , Ji Hun Yi
- 申请人： Amkor Technology Singapore Holding Pte. Ltd.
- 申请人地址： SG Singapore
- 专利权人： AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
- 当前专利权人： AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
- 当前专利权人地址： SG Singapore
- 代理机构： McAndrews, Held & Malloy, Ltd.
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/538 ; H01L25/00 ; H01L23/31 ; H01L23/498
摘要：
Various aspects of this disclosure provide a semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising a stacked die structure and a method of manufacturing thereof.
公开/授权文献
- US20220068889A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF 公开/授权日：2022-03-03
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