An intelligent subsystem coupled with a Super System on Chip (SSoC)/microprocessor, a radio transceiver, a voice processing module/voice processing algorithm, a display component, one or more camera sensors/computational cameras for three-dimensional (3-D) sensing of the surroundings, a near-field communication device, a biometric sensor, an artificial eye, a biological lab-on-chip (LOC)/DNA sequencing biomodule, an intelligent learning algorithm and an algorithm for three-dimensional (3-D) perception is disclosed. The Super System on Chip (SSoC) includes memristors. The intelligent subsystem can respond to a user's interests and/or preferences, provide telepresence and perceive the surroundings. Furthermore, the intelligent subsystem is sensor-aware or context-aware.