Invention Grant
- Patent Title: Joint structure, electronic device and method for manufacturing the joint structure
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Application No.: US17509242Application Date: 2021-10-25
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Publication No.: US11849566B2Publication Date: 2023-12-19
- Inventor: Toshihiro Miyake , Tadatomo Suga , Eiji Higurashi
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: POSZ LAW GROUP, PLC
- Priority: JP 20181681 2020.10.29
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02 ; H05K3/00 ; H01L23/373

Abstract:
A joint structure includes a first member, a second member and a metal joint layer. The first member has including a first surface and is made of material having one of copper, copper alloy, aluminum, or aluminum alloy. The second member includes a second surface that faces the first surface of the first material. The metal joint layer includes a gold joint layer made of material having gold or gold alloy and is disposed between the first surface of the first material and the second surface of the second material. A thickness of the metal joint layer is smaller than flatness of the first surface of the first material and flatness of the second surface of the second material. Fluorine is dispersed inside at least the gold joint layer included in the metal joint layer.
Public/Granted literature
- US20220142005A1 JOINT STRUCTURE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE JOINT STRUCTURE Public/Granted day:2022-05-05
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