Invention Grant
- Patent Title: Solvent-free composition based on 2,4,7,9-tetramethyl-5-decyne-4,7-diol
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Application No.: US17172348Application Date: 2021-02-10
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Publication No.: US11851574B2Publication Date: 2023-12-26
- Inventor: Roger Reinartz , Kenneth Michael Peck , Petra Hinrichs
- Applicant: Evonik Operations GmbH
- Applicant Address: DE Essen
- Assignee: Evonik Operations GmbH
- Current Assignee: Evonik Operations GmbH
- Current Assignee Address: DE Essen
- Agency: Grüneberg and Myers PLLC
- Priority: EP 157331 2020.02.14
- Main IPC: C09D171/08
- IPC: C09D171/08 ; C09D7/45 ; C09K23/42 ; C09K23/38
Abstract:
A solvent-free composition contains the following components: 2,4,7,9-tetramethyl-5-decyne-4,7-diol, ethoxylates thereof, and polyethylene glycols, wherein the composition contains water and wherein the concentration of 2,4,7,9-tetramethyl-5-decyne-4,7-diol is greater than 40% by weight, based on the composition.
Public/Granted literature
- US20210253896A1 Solvent-free composition based on 2,4,7,9-tetramethyl-5-decyne-4,7-diol Public/Granted day:2021-08-19
Information query
IPC分类:
