Methods, systems, and apparatus for conducting chucking operations are disclosed that use an adjusted chucking voltage if a process shift occurs. In one implementation, a method includes conducting a first processing operation on a substrate in a processing chamber. The first processing operation includes applying a chucking voltage to an electrostatic chuck (ESC) in the processing chamber while the substrate is supported on the ESC. The method includes determining that a process shift has occurred. The determining that the process shift has occurred includes one or more of: determining that a center of the substrate has moved by a post-processing shift relative to a pre-processing location of the center prior to the first processing operation, or determining that a defect count of a backside surface of the substrate exceeds a defect threshold. The method includes determining an adjusted chucking voltage based on the occurrence of the process shift.