A packaging substrate, a packaging structure, an electronic device and a manufacturing method, and pertain to the field of chip packaging technologies. The packaging substrate includes a body including metal cabling. The body includes a first surface, a second surface and a side surface. The side surface is connected to the first surface and second surface. The first surface includes many first connection structures. The second surface includes second connection structures. The side surface includes third connection structures. A part of the first connection structures are connected to the second connection structures by using the metal cabling. The other part of the first connection structures are connected to the third connection structures by using the metal cabling. When the same total quantity of pins need to be disposed, a part of the pins are transferred to the side surface of the body, with less pins at the second surface.