- 专利标题： Connector housing assembly
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申请号： US17411157申请日： 2021-08-25
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公开(公告)号： US11855371B2公开(公告)日： 2023-12-26
- 发明人: Fei He , Hongqiang (Sean) Han , WenYu (Vindy) Liu
- 申请人： Tyco Electronics (Shanghai) Co. Ltd.
- 申请人地址： CN Shanghai
- 专利权人： Tyco Electronics (Shanghai) Co., Ltd.
- 当前专利权人： Tyco Electronics (Shanghai) Co., Ltd.
- 当前专利权人地址： CN Shanghai
- 代理机构： Barley Snyder
- 优先权： CN 2021825372.5 2020.08.27
- 主分类号： H01R13/46
- IPC分类号： H01R13/46 ; H01R12/71
摘要：
A connector housing assembly includes a housing installed on a circuit board and a heat sink installed on the housing. The heat sink has a front end portion on a top of the housing and a rear end portion extending beyond the housing. A fixing member connected to the housing installs the front end portion of the heat sink on the housing. The connector housing assembly includes a supporting device on the circuit board. The supporting device supports the rear end portion of the heat sink on the circuit board.
公开/授权文献
- US20220069495A1 Connector Housing Assembly 公开/授权日：2022-03-03
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