Invention Grant
- Patent Title: Closed loop temperature controlled circuit to improve device stability
-
Application No.: US17472247Application Date: 2021-09-10
-
Publication No.: US11856657B2Publication Date: 2023-12-26
- Inventor: Fuchao Wang , Olivier Leneel , Ravi Shankar
- Applicant: STMICROELECTRONICS ASIA PACIFIC PTE LTD , STMICROELECTRONICS, INC.
- Applicant Address: SG TX Singapore
- Assignee: STMICROELECTRONICS ASIA PACIFIC PTE LTD,STMICROELECTRONICS, INC.
- Current Assignee: STMICROELECTRONICS ASIA PACIFIC PTE LTD,STMICROELECTRONICS, INC.
- Current Assignee Address: SG Singapore; US TX Coppell
- Agency: SEED INTELLECTUAL PROPERTY LAW GROUP LLP
- The original application number of the division: US16233926 2018.12.27
- Main IPC: H05B3/00
- IPC: H05B3/00 ; H05B1/02 ; H05B3/34 ; H05B3/12 ; H01L23/34 ; H05B3/02 ; H05B3/06

Abstract:
An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.
Public/Granted literature
- US20220030667A1 CLOSED LOOP TEMPERATURE CONTROLLED CIRCUIT TO IMPROVE DEVICE STABILITY Public/Granted day:2022-01-27
Information query