Invention Grant
- Patent Title: Memory device and method for forming the same
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Application No.: US17750979Application Date: 2022-05-23
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Publication No.: US11856768B2Publication Date: 2023-12-26
- Inventor: Hsin-Wen Su , Chia-En Huang , Shih-Hao Lin , Lien-Jung Hung , Ping-Wei Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H10B41/30
- IPC: H10B41/30 ; H01L23/522 ; G11C7/18 ; H01L29/872 ; G11C8/14 ; H10B43/30

Abstract:
A memory device includes a substrate, a first transistor and a second transistor, a Schottky diode, a first word line, a second word line, and a bit line. The first transistor and the second transistor are over the substrate, wherein a first source/drain structure of the first transistor is electrically connected to a first source/drain structure of the second transistor. The Schottky diode is electrically connected to a gate structure of the first transistor. The first word line is electrically connected to the gate structure of the first transistor through the Schottky diode. The second word line is electrically connected to a gate structure of the second transistor. The bit line is electrically connected to a second source/drain structure of the second transistor.
Public/Granted literature
- US20220293616A1 MEMORY DEVICE AND METHOD FOR FORMING THE SAME Public/Granted day:2022-09-15
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