Invention Grant
- Patent Title: Resistor component
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Application No.: US17743766Application Date: 2022-05-13
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Publication No.: US11862365B2Publication Date: 2024-01-02
- Inventor: Jang Suk Yoon , Hyung Min Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20220018242 2022.02.11
- Main IPC: H01C1/14
- IPC: H01C1/14 ; H01C7/00

Abstract:
A resistor component includes a substrate having a first surface and a second surface, opposing each other; an external electrode disposed outside of the substrate; a resistive layer disposed on the first surface of the substrate, connected to the external electrode, and including an alloy of a first metal and a second metal; and a first protective layer disposed on the resistive layer and including any one of the first and second metals.
Public/Granted literature
- US20230260682A1 RESISTOR COMPONENT Public/Granted day:2023-08-17
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