Invention Grant
- Patent Title: Coil component
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Application No.: US17399752Application Date: 2021-08-11
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Publication No.: US11862386B2Publication Date: 2024-01-02
- Inventor: Byung Soo Kang , Byeong Cheol Moon , Joung Gul Ryu , Ju Hwan Yang
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20180058576 2018.05.23
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/29 ; H01F27/28 ; H01F41/04 ; H01F27/34

Abstract:
A coil component includes a body having a first surface and a second surface opposing each other in a thickness direction of the body and including a core formed in the thickness direction; a coil part embedded in the body and including at least one turn around the core; an insulating layer disposed on the first surface of the body; a bonded conductive layer disposed on the insulating layer and having a surface roughness of the first surface which is in contact with the insulating layer greater than a surface roughness of the second surface opposing the first surface of the bonded conductive layer; and external electrodes connected to the coil part and covering the bonded conductive layer.
Public/Granted literature
- US20210375530A1 COIL COMPONENT Public/Granted day:2021-12-02
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