Invention Grant
- Patent Title: Multilayered electronic component and dielectric composition
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Application No.: US17318497Application Date: 2021-05-12
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Publication No.: US11862399B2Publication Date: 2024-01-02
- Inventor: Kyung Sik Kim , Jong Hwan Lee , Jeong Yun Park , Tae Young Ham , In Tae Seo , Jae Sung Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20200183641 2020.12.24
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H01G4/30 ; C04B35/468

Abstract:
A multilayer electronic component according to some embodiments of the present disclosure includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein a ratio of the number of dielectric grains having a size of 100 to 250 nm included in the dielectric layer is 55% or more with respect to a total number of the dielectric grains included in the dielectric layer.
Public/Granted literature
- US20220208454A1 MULTILAYERED ELECTRONIC COMPONENT AND DIELECTRIC COMPOSITION Public/Granted day:2022-06-30
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