Invention Grant
- Patent Title: Semiconductor package structure
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Application No.: US17575789Application Date: 2022-01-14
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Publication No.: US11862578B2Publication Date: 2024-01-02
- Inventor: Chia-Cheng Chang , Tzu-Hung Lin , I-Hsuan Peng , Yi-Jou Lin
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsinchu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/053 ; H01L23/31 ; H01L23/367 ; H01L23/498 ; H01L25/16
Abstract:
A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a semiconductor die disposed over the substrate, and a frame disposed over the substrate. The frame is adjacent to the semiconductor die, and an upper surface of the frame is lower than the upper surface of the semiconductor die. IN addition, a passive component is disposed on the substrate and located between the frame and the semiconductor die.
Public/Granted literature
- US20220139848A1 SEMICONDUCTOR PACKAGE STRUCTURE Public/Granted day:2022-05-05
Information query
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