Invention Grant
- Patent Title: Hybrid wireless transceiver architecture that supports multiple antenna arrays
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Application No.: US17653449Application Date: 2022-03-03
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Publication No.: US11862861B2Publication Date: 2024-01-02
- Inventor: Li Liu , Kevin Hsi Huai Wang , Yunfei Feng , Chuan Wang , Gurkanwal Sahota
- Applicant: Qualcomm Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Colby Nipper/Qualcomm Incorporated
- Main IPC: H01Q21/30
- IPC: H01Q21/30 ; H01Q5/35 ; H04B1/18 ; H04B1/44 ; H01Q21/06

Abstract:
An apparatus is disclosed for a hybrid wireless transceiver architecture that supports multiple antenna arrays. In an example aspect, the apparatus includes a first antenna array, a second antenna array, and a wireless transceiver. The wireless transceiver includes first dedicated circuitry dedicated to the first antenna array and second dedicated circuitry dedicated to the second antenna array. The wireless transceiver also includes shared circuitry that is shared with both the first antenna array and the second antenna array.
Public/Granted literature
- US20220224022A1 Hybrid Wireless Transceiver Architecture that Supports Multiple Antenna Arrays Public/Granted day:2022-07-14
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