Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US17941354Application Date: 2022-09-09
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Publication No.: US11863150B2Publication Date: 2024-01-02
- Inventor: Takuya Sato
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 21149381 2021.09.14
- Main IPC: H03H7/01
- IPC: H03H7/01 ; H01F27/28 ; H01G4/30 ; H01F27/40 ; H03H1/00

Abstract:
An electronic component includes a stack and first to fourth inductors. The second inductor is disposed after the first inductor in a −Y direction. The third inductor and the fourth inductor are disposed after the first inductor and the second inductor, respectively, in a −X direction. Two or more through hole columns are connected in parallel to a part near each end of a conductor layer portion in each of the first inductor and the fourth inductor in a longitudinal direction. One through hole column is connected to a part near each end of a conductor layer portion in each of the second inductor and the third inductor in a longitudinal direction.
Public/Granted literature
- US20230081943A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2023-03-16
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