• Patent Title: Substrate and antenna module
  • Application No.: US17268170
    Application Date: 2020-08-24
  • Publication No.: US11864308B2
    Publication Date: 2024-01-02
  • Inventor: Michikazu Tomita
  • Applicant: Fujikura Ltd.
  • Applicant Address: JP Tokyo
  • Assignee: FUJIKURA LTD.
  • Current Assignee: FUJIKURA LTD.
  • Current Assignee Address: JP Tokyo
  • Agency: WHDA, LLP
  • Priority: JP 20005342 2020.01.16
  • International Application: PCT/JP2020/031816 2020.08.24
  • International Announcement: WO2021/145015A 2021.07.22
  • Date entered country: 2021-02-12
  • Main IPC: H01Q1/38
  • IPC: H01Q1/38 H05K1/02 H01Q1/12 H05K1/11
Substrate and antenna module
Abstract:
A substrate includes, two first through-holes to which high-frequency signals are transmitted and which are arranged side by side so as to have a predetermined distance, and at least three reference potential second through-holes arranged side by side so as to have an distance smaller than the predetermined distance with respect to the two first through-holes. Among three of the second through-holes, one of the second through-holes is arranged in a region between the two first through-holes, and other two of the second through-holes are arranged in a region other than the region between the first through-holes such that one of the other two second through-holes is arranged side by side with respect to one of the two first through-holes, and the other of other two second through-holes is arranged side by side with respect to the other of the two first through-holes.
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