Invention Grant
- Patent Title: Airtight package including a package base and a glass cover hermetically sealed with each other via a sealing material layer
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Application No.: US16482764Application Date: 2018-02-05
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Publication No.: US11871676B2Publication Date: 2024-01-09
- Inventor: Toru Shiragami , Hiroki Fujita
- Applicant: Nippon Electric Glass Co., Ltd.
- Applicant Address: JP Shiga
- Assignee: NIPPON ELECTRIC GLASS CO., LTD.
- Current Assignee: NIPPON ELECTRIC GLASS CO., LTD.
- Current Assignee Address: JP Shiga
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 17020004 2017.02.07
- International Application: PCT/JP2018/003753 2018.02.05
- International Announcement: WO2018/147210A 2018.08.16
- Date entered country: 2019-08-01
- Main IPC: H10N30/88
- IPC: H10N30/88 ; H01L23/08 ; H01L23/10

Abstract:
A hermetic package of the present invention includes a package base and a glass cover hermetically sealed with each other via a sealing material layer, wherein the package base includes a base part and a frame part formed on the base part, wherein the package base has an internal device housed within the frame part, wherein the sealing material layer is arranged between a top of the frame part of the package base and the glass cover, and wherein an end portion of the sealing material layer protrudes laterally in an arc shape in sectional view.
Public/Granted literature
- US20190355893A1 AIRTIGHT PACKAGE Public/Granted day:2019-11-21
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