- 专利标题: Lamination molding apparatus
-
申请号: US17035758申请日: 2020-09-29
-
公开(公告)号: US11872759B2公开(公告)日: 2024-01-16
- 发明人: Atsushi Kawamura , Kensuke Kashimura , Toshio Kaji , Yoshifumi Ichikawa , Yasuyuki Miyashita
- 申请人: SODICK CO., LTD.
- 申请人地址: JP Kanagawa
- 专利权人: Sodick Co., Ltd.
- 当前专利权人: Sodick Co., Ltd.
- 当前专利权人地址: JP Kanagawa
- 代理机构: JCIPRNET
- 优先权: JP 19219664 2019.12.04
- 主分类号: B22F12/49
- IPC分类号: B22F12/49 ; B29C64/277 ; B23K26/082 ; B22F10/00 ; B22F12/00 ; B22F10/28 ; B22F12/44 ; B33Y30/00 ; B22F12/41 ; B22F12/45 ; B22F12/67 ; B22F10/32
摘要:
An irradiation device of a lamination molding apparatus includes: at least one laser source, generating a laser beam; a first galvano scanner, scanning the laser beam; a second galvano scanner, scanning the laser beam; and an irradiation controller, controlling the laser source, the first galvano scanner, and the second galvano scanner. Irradiable ranges of the laser beams by using the first galvano scanner and the second galvano scanner respectively include an entire of a molding region. A first X-axis galvano mirror and a first Y-axis galvano mirror of the first galvano scanner and a second X-axis galvano mirror and a second Y-axis galvano mirror of the second galvano scanner are disposed to be plane-symmetric to each other.
公开/授权文献
- US20210170526A1 LAMINATION MOLDING APPARATUS 公开/授权日:2021-06-10
信息查询