A manufacturing method of an electronic device is provided. First, a mother panel including a first flexible mother board, a second flexible mother board and at least one sealing material is provided, and the sealing material is disposed between the first flexible mother board and the second flexible mother board. Then, a separating process including a laser-cutting process is performed to cut the first flexible mother board into a first flexible substrate and to cut the second flexible mother board into a second flexible substrate. The first flexible substrate includes a first laser-cutting buffer region and a first edge. The second flexible substrate includes a second laser-cutting buffer region and a second edge. The sealing material is away from the first edge by the first laser-cutting buffer region and away from the second edge by the second laser-cutting buffer region.