Invention Grant
- Patent Title: Modularized DC interconnection device and system thereof
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Application No.: US17433954Application Date: 2019-03-27
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Publication No.: US11876367B2Publication Date: 2024-01-16
- Inventor: Chunming Yuan , Xiaobo Yang , Xing Huang
- Applicant: ABB Schweiz AG
- Applicant Address: CH Baden
- Assignee: ABB SCHWEIZ AG
- Current Assignee: ABB SCHWEIZ AG
- Current Assignee Address: CH Baden
- Agency: Greenberg Traurig, LLP
- International Application: PCT/CN2019/079852 2019.03.27
- International Announcement: WO2020/191652A 2020.10.01
- Date entered country: 2021-08-25
- Main IPC: H02J1/00
- IPC: H02J1/00

Abstract:
Embodiments of a modular direct current interconnection device (MDCID) include at least three operation branches, at least one transient branch, and a local controller. Each of the operation branches includes a first terminal coupled to a common node and configured to transmit DC current in a normal mode. The transient branch is coupled between second terminals of different ones of the at least three operation branches and configured to provide a transient DC current path in a fault clearance mode. The local controller is coupled to the operation branches and the transient branch, and the local controller is configured to control operation of the operation branches and the transient branch.
Public/Granted literature
- US20220149617A1 MODULARIZED DC INTERCONNECTION DEVICE AND SYSTEM THEREOF Public/Granted day:2022-05-12
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