- 专利标题: Flexible wiring board, module, and electronic device
-
申请号: US17725803申请日: 2022-04-21
-
公开(公告)号: US11877392B2公开(公告)日: 2024-01-16
- 发明人: Mitsutoshi Hasegawa , Yuya Okada , Satoru Higuchi , Koji Noguchi
- 申请人: CANON KABUSHIKI KAISHA
- 申请人地址: JP Tokyo
- 专利权人: CANON KABU KIKA HA KAISHA
- 当前专利权人: CANON KABU KIKA HA KAISHA
- 当前专利权人地址: JP Tokyo
- 代理机构: VENABLE LLP
- 优先权: JP 21074465 2021.04.26
- 主分类号: H05K1/18
- IPC分类号: H05K1/18 ; H05K1/02
摘要:
A flexible wiring board includes: an insulator; a wiring layer supported by the insulator; a first terminal unit including connection terminals provided at one end of the wiring layer; and a second terminal unit including connection terminals provided at the other end. A portion of the wiring layer from a part adjacent to the first terminal unit to a part adjacent to the second terminal unit is provided between first and second insulator layers included in the insulator. First and second holes formed in the first or second insulator layer are provided in an intermediate portion in a first direction from the first terminal unit to the second terminal unit and are spaced apart from each other in the first direction, and an insulator region adjacent to the first hole in a second direction is adjacent to at least a part of the second hole in the first direction.
公开/授权文献
- US20220346219A1 FLEXIBLE WIRING BOARD, MODULE, AND ELECTRONIC DEVICE 公开/授权日:2022-10-27
信息查询