Invention Grant
- Patent Title: Multilayer ceramic electronic component
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Application No.: US18121040Application Date: 2023-03-14
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Publication No.: US11881356B2Publication Date: 2024-01-23
- Inventor: Shinobu Chikuma , Nobuyuki Koizumi , Akio Masunari , Yukie Watanabe
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP 20031152 2020.02.27
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30 ; H01G4/12 ; H01G4/248

Abstract:
A multilayer ceramic electronic component includes a multilayer body including layered ceramic layers and layered inner electrode layers and having a rectangular parallelepiped shape, and outer electrodes covering both end surfaces of the multilayer body and extending from both end surfaces to cover at least a portion of a first main surface of the multilayer body. The multilayer ceramic capacitor includes an insulating layer continuously extending from a ceramic layer at the first main surface of the multilayer body so as to cover end edge portions of both the outer electrodes located on the first main surface of the multilayer body, and t2>t1 is satisfied.
Public/Granted literature
- US20230215644A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2023-07-06
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