Invention Grant
- Patent Title: Heat dissipation sheet and electronic device including same
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Application No.: US17402055Application Date: 2021-08-13
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Publication No.: US11881612B2Publication Date: 2024-01-23
- Inventor: Seunghoon Kang , Jinhyoung Lee , Kyungha Koo , Jinmyoung Kim , Hongki Moon , Yoonsun Park , Seyoung Jang , Seungjae Hwang
- Applicant: Samsung Electronics Co., Ltd. , Amotech Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.,Amotech Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.,Amotech Co., Ltd.
- Current Assignee Address: KR Suwon-si; KR Incheon
- Priority: KR 20190018147 2019.02.15
- Main IPC: H01Q1/02
- IPC: H01Q1/02 ; H01Q1/24

Abstract:
An electronic device according to various embodiments of the present disclosure can comprise: a front plate facing a first direction; a rear plate facing a second direction, which is opposite to the first direction; at least one antenna module arranged between the front plate and the rear plate; and at least one heat dissipation sheet spaced from the at least one antenna module so as to be arranged to come in contact with the rear plate. The at least one heat dissipation sheet can comprise a ceramic filler and a binder resin mixed with the ceramic filler.
Public/Granted literature
- US20210391636A1 HEAT DISSIPATION SHEET AND ELECTRONIC DEVICE INCLUDING SAME Public/Granted day:2021-12-16
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