- Patent Title: Semiconductor laser element and method for manufacturing the same
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Application No.: US17685820Application Date: 2022-03-03
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Publication No.: US11881684B2Publication Date: 2024-01-23
- Inventor: Yoshitaka Nakatsu
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Foley & Lardner LLP
- Priority: JP 19005760 2019.01.17 JP 19141147 2019.07.31
- Main IPC: H01S5/343
- IPC: H01S5/343 ; H01S5/20 ; H01S5/22 ; H01S5/042

Abstract:
A semiconductor laser element includes: an n-side semiconductor layer formed of a nitride semiconductor; an active layer disposed on or above the n-side semiconductor layer and formed of a nitride semiconductor; a p-side semiconductor layer disposed on the active layer, formed of a nitride semiconductor, and including: an undoped first part disposed in contact with an upper face of the active layer and comprising at least one semiconductor layer, an electron barrier layer disposed in contact with an upper face of the first part, containing a p-type impurity, and having a band gap energy that is larger than a band gap energy of the first part, and a second part disposed in contact with the upper face of the electron barrier layer and comprising at least one p-type semiconductor layer containing a p-type impurity; and a p-electrode disposed in contact with the upper face of the second part.
Public/Granted literature
- US20220271510A1 SEMICONDUCTOR LASER ELEMENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-08-25
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