- 专利标题: Electromagnetic shielding structure and manufacturing method thereof, and electronic device
-
申请号: US17614844申请日: 2019-12-06
-
公开(公告)号: US11882681B2公开(公告)日: 2024-01-23
- 发明人: Kaiwei Wang , Dewen Tian , Qinglin Song
- 申请人: Weifang Goertek Microelectronics Co., Ltd.
- 申请人地址: CN Shandong
- 专利权人: Weifang Goertek Microelectronics Co. Ltd.
- 当前专利权人: Weifang Goertek Microelectronics Co. Ltd.
- 当前专利权人地址: CN Weifang
- 代理机构: Baker Botts, LLP
- 优先权: CN 1910455863.0 2019.05.28
- 国际申请: PCT/CN2019/123557 2019.12.06
- 国际公布: WO2020/238139A 2020.12.03
- 进入国家日期: 2021-11-29
- 主分类号: H05K9/00
- IPC分类号: H05K9/00
摘要:
Disclosed are an electromagnetic shielding structure and a manufacturing method thereof, and an electronic product. The manufacturing method includes covering an injection mold on a circuit substrate, so that different circuit units on the circuit substrate are respectively accommodated in different injection molding cavities of the injection mold; injecting a non-conductive plastic sealant into the injection molding cavities so as to form non-conductive plastic sealing bodies on the circuit units, wherein spacing grooves are formed between the non-conductive plastic sealing bodies; and forming a conductive shielding layer on the non-conductive plastic sealing bodies, so that the conductive shielding layer covers the non-conductive plastic sealing bodies and fills the spacing grooves to form shielding barrier walls, thereby realizing shielding between the different circuit units in respective cavities.
公开/授权文献
信息查询