Invention Grant
- Patent Title: Dual-wavelength laser systems and material processing utilizing such systems
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Application No.: US16984489Application Date: 2020-08-04
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Publication No.: US11883904B2Publication Date: 2024-01-30
- Inventor: Wang-Long Zhou , Francisco Villarreal-Saucedo , Bien Chann , Mark Mordarski , Bryan Lochman
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: B23K26/34
- IPC: B23K26/34 ; B23K26/0622 ; B23K103/00
Abstract:
In various embodiments, laser beams of two different wavelengths are utilized, sequentially and/or simultaneously, to process workpieces in various processing stages such as melting, piercing, cutting, and welding.
Public/Granted literature
- US20210039200A1 DUAL-WAVELENGTH LASER SYSTEMS AND MATERIAL PROCESSING UTILIZING SUCH SYSTEMS Public/Granted day:2021-02-11
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