Invention Grant
- Patent Title: Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion and molded article comprising same
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Application No.: US17810878Application Date: 2022-07-06
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Publication No.: US11884802B2Publication Date: 2024-01-30
- Inventor: Jin Young Yoon , Hee Joon Lee , Dong Eun Cha , Sun Jun Kwon , Chun Ho Park , Seung Ryong Jeong , Jin Bo Chae
- Applicant: Hyundai Motor Company , Kia Corporation , HDC Hyundai Engineering Plastics Co., Ltd.
- Applicant Address: KR Seoul
- Assignee: HYUNDAI MOTOR COMPANY,KIA CORPORATION,HDC HYUNDAI ENGINEERING PLASTICS CO., LTD.
- Current Assignee: HYUNDAI MOTOR COMPANY,KIA CORPORATION,HDC HYUNDAI ENGINEERING PLASTICS CO., LTD.
- Current Assignee Address: KR Seoul; KR Seoul; KR Dangjin-si
- Agency: MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP
- Priority: KR 20210088631 2021.07.06
- Main IPC: C08L23/12
- IPC: C08L23/12 ; C08L23/14
Abstract:
The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene composite resin including high-crystalline polypropylene and the like, an elastomer, and an inorganic filler.
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