- 专利标题： Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion and molded article comprising same
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申请号： US17810878申请日： 2022-07-06
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公开(公告)号： US11884802B2公开(公告)日： 2024-01-30
- 发明人: Jin Young Yoon , Hee Joon Lee , Dong Eun Cha , Sun Jun Kwon , Chun Ho Park , Seung Ryong Jeong , Jin Bo Chae
- 申请人： Hyundai Motor Company , Kia Corporation , HDC Hyundai Engineering Plastics Co., Ltd.
- 申请人地址： KR Seoul
- 专利权人： HYUNDAI MOTOR COMPANY,KIA CORPORATION,HDC HYUNDAI ENGINEERING PLASTICS CO., LTD.
- 当前专利权人： HYUNDAI MOTOR COMPANY,KIA CORPORATION,HDC HYUNDAI ENGINEERING PLASTICS CO., LTD.
- 当前专利权人地址： KR Seoul; KR Seoul; KR Dangjin-si
- 代理机构： MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP
- 优先权： KR 20210088631 2021.07.06
- 主分类号： C08L23/12
- IPC分类号： C08L23/12 ; C08L23/14
摘要：
The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene composite resin including high-crystalline polypropylene and the like, an elastomer, and an inorganic filler.
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