Invention Grant
- Patent Title: Display backplane, manufacturing method thereof, and full-screen fingerprint identification display device
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Application No.: US17043725Application Date: 2020-04-20
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Publication No.: US11887401B2Publication Date: 2024-01-30
- Inventor: Xueguang Hao , Hongfei Cheng , Yongda Ma
- Applicant: Beijing BOE Technology Development Co., Ltd. , BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: Beijing BOE Technology Development Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee: Beijing BOE Technology Development Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing; CN Beijing
- Agency: Ling and Yang Intellectual Property
- Agent Ling Wu; Stephen Yang
- Priority: CN 1910514410.0 2019.06.14
- International Application: PCT/CN2020/085731 2020.04.20
- International Announcement: WO2020/248716A 2020.12.17
- Date entered country: 2020-09-30
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06V40/13 ; H10K59/65 ; H10K59/122 ; H10K59/124 ; H10K71/00 ; H10K59/12

Abstract:
The present disclosure provides a display backplane, a method for manufacturing the same and a full-screen fingerprint identification display device. The display backplane includes a substrate; a circuit layer disposed on a surface of the substrate; a light emitting device layer disposed on a surface of the circuit layer away from the substrate; and a plurality of fingerprint identification photodetectors disposed in at least one of the circuit layer and the light emitting device layer.
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