Invention Grant
- Patent Title: Integrated circuit device
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Application No.: US17352973Application Date: 2021-06-21
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Publication No.: US11888039B2Publication Date: 2024-01-30
- Inventor: Yonghee Park , Myunggil Kang , Uihui Kwon , Seungkyu Kim , Ahyoung Kim , Youngseok Song
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR 20200161185 2020.11.26
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/06 ; H01L29/423 ; H01L29/786 ; H01L27/088

Abstract:
An integrated circuit device includes a fin-type active region disposed on a substrate and extending in a first horizontal direction, a gate line disposed on the fin-type active region and extending in a second horizontal direction intersecting the first horizontal direction, the gate line including, a connection protrusion portion including a protrusion top surface at a first vertical level from the substrate, and a main gate portion including a recess top surface extending in the second horizontal direction from the connection protrusion portion, the recess top surface being at a second vertical level lower than the first vertical level, a gate contact disposed on the gate line and connected to the connection protrusion portion, a source/drain region disposed on the fin-type active region and disposed adjacent to the gate line, and a source/drain contact disposed on the source/drain region.
Public/Granted literature
- US20220165857A1 INTEGRATED CIRCUIT DEVICE Public/Granted day:2022-05-26
Information query
IPC分类: