Invention Grant
- Patent Title: Cooling conduit for electrical components on a PCB
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Application No.: US17382526Application Date: 2021-07-22
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Publication No.: US11889614B2Publication Date: 2024-01-30
- Inventor: Lathom Alexander Louco
- Applicant: BorgWarner Inc.
- Applicant Address: US MI Auburn Hills
- Assignee: BORGWARNER INC.
- Current Assignee: BORGWARNER INC.
- Current Assignee Address: US MI Auburn Hills
- Agency: REISING ETHINGTON P.C.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K7/20 ; H05K5/00

Abstract:
An electronics assembly used in a vehicle included a printed circuit board (PCB) having a first side and a second side; a plurality of electrical components mounted on the first side of the PCB; a heat sink, configured to receive cooling fluid from a source, positioned adjacent to the second side of the PCB; and a cooling fluid conduit, configured to communicate the cooling fluid from a fluid inlet to a fluid outlet, wherein the cooling fluid conduit is positioned adjacent to the first side of the PCB and directly contacts an outer surface of the electrical components.
Public/Granted literature
- US20230028967A1 COOLING CONDUIT FOR ELECTRICAL COMPONENTS ON A PCB Public/Granted day:2023-01-26
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