Invention Grant
- Patent Title: Wiring board, electronic component package, and electronic apparatus
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Application No.: US17605162Application Date: 2020-04-27
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Publication No.: US11889618B2Publication Date: 2024-01-30
- Inventor: Toshihiko Kitamura
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Volpe Koenig
- Priority: JP 19084011 2019.04.25
- International Application: PCT/JP2020/017957 2020.04.27
- International Announcement: WO2020/218608A 2020.10.29
- Date entered country: 2021-10-20
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K1/02
Abstract:
A dielectric substrate has a first surface including a first terminal joint and a second terminal joint arranged along a first side surface. A first lead terminal is bonded to the first terminal joint with a bond. A second lead terminal is bonded to the second terminal joint with a bond. The first lead terminal includes a first base bonded to the first terminal joint and a first lead extending from the first base. The second lead terminal includes a second base bonded to the second terminal joint and a second lead extending from the second base. The first lead terminal includes the first base having a larger thickness than the first lead.
Public/Granted literature
- US20220217834A1 WIRING BOARD, ELECTRONIC COMPONENT PACKAGE, AND ELECTRONIC APPARATUS Public/Granted day:2022-07-07
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