Invention Grant
- Patent Title: High-speed connector
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Application No.: US17567862Application Date: 2022-01-03
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Publication No.: US11894632B2Publication Date: 2024-02-06
- Inventor: Sheng-Yuan Huang , Chun-Fu Lin , Yun-Chien Lee , Pei-Yi Lin , Yi-Ching Hsu
- Applicant: Cheng Uei Precision Industry Co., LTD.
- Applicant Address: TW New Taipei
- Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
- Current Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agent Cheng-Ju Chiang
- Priority: CN 2120876316.2 2021.04.26
- Main IPC: H01R13/405
- IPC: H01R13/405 ; H01R13/6471 ; H01R12/72 ; H01R12/70

Abstract:
A high-speed connector includes an insulating housing, and a first terminal assembly mounted in the insulating housing. The first terminal assembly includes a plurality of first terminals, a first base body and a first conductive film. The plurality of the first terminals include at least two first grounding terminals and at least two first signal terminals. At least one portion of a bottom of the first base body extends downward to form at least one first protruding portion. The at least two first signal terminals penetrate through the at least one first protruding portion. The first conductive film is covered to the at least one first protruding portion. The first conductive film has a first metal layer. The first metal layer is electrically connected with the at least two first grounding terminals to form a grounding structure.
Public/Granted literature
- US20220344854A1 HIGH-SPEED CONNECTOR Public/Granted day:2022-10-27
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