- 专利标题: Induction heating apparatus
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申请号: US17192239申请日: 2021-03-04
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公开(公告)号: US11895759B2公开(公告)日: 2024-02-06
- 发明人: Masashi Sasagawa , Masaki Ono , Masayuki Otawara , Nobuharu Nishikoori , Taro Yoshida , Tomoyuki Kanagawa , Yutaka Yagi
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Jefferson IP Law, LLP
- 优先权: JP 20047466 2020.03.18 KR 20200187185 2020.12.30
- 主分类号: H05B6/08
- IPC分类号: H05B6/08 ; H05B6/12
摘要:
An induction heating apparatus is provided. The induction heating apparatus includes a heating coil configured to heat an object to be heated, a full-bridge type inverter configured to supply power to the heating coil, a capacitor provided between an intermediate node of one arm of the inverter and one end of the heating coil, and a first relay provided between the intermediate node and the other end of the heating coil 30. An intermediate node of the other arm of the inverter and an intermediate point of the heating coil are connected through a first wire. The induction heating apparatus includes a processor configured to open or close the first relay based on an impedance of the object to be heated.
公开/授权文献
- US20210298134A1 INDUCTION HEATING APPARATUS 公开/授权日:2021-09-23
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