In a flexible printed wiring board (1), a first electrical conduction pattern (4) prepared on the first surface (3a) on which a bare chip (2) is mounted is prepared only inside a mounting region (3c) of the bare chip. Preferably, the first electrical conduction patterns (4) are prepared so as to avoid positions opposite to test electrodes (2b) which the bare chip comprises. Thereby, in the flexible printed wiring board used for mounting the bare chip, occurrence of malfunction resulting from electrical connection with a part other than a bump of the bare chip can be certainly prevented, and reliability of various devices using the bare chip can be improved.